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| october 2008 order number: e51290-001us the intel ? desktop board DX58SO may contain design defects or errors known as errata that may cause the product to deviate from published specifications. current characterized errata are documented in the in tel desktop board DX58SO specification update. intel? desktop board DX58SO technical product specification
revision history revision revision history date -001 first release of the intel ? desktop board DX58SO technical product specification october 2008 this product specification applies to only the standard intel ? desktop board DX58SO with bios identifier sox5810j.86a. changes to this specification will be published in the intel desktop board DX58SO specification update before being incorporated into a revision of this document. information in this document is pr ovided in connection with intel ? products. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. exce pt as provided in intel?s term s and conditions of sale for such products, intel assumes no liability what soever, and intel disclaims any express or implied warranty, relating to sale and/or us e of intel products in cluding liability or warranties relating to fitness for a particul ar purpose, merchantabi lity, or infringement of any patent, copyright or other intellectual property right. unle ss otherwise agreed in writing by intel, the intel pr oducts are not designed nor in tended for any application in which the failure of the intel product could cr eate a situation where personal injury or death may occur. all intel ? desktop boards are evaluated as information tec hnology equipment (i.t.e.) for use in personal computers (pc) for installation in homes, offices, schools, computer rooms, and similar locations. the suitability of this product for other pc or embedded non-pc applications or other environments, such as medical, industrial, alarm systems, te st equipment, etc. may not be suppo rted without further evaluation by intel. intel corporation may have patents or pending pate nt applications, trademar ks, copyrights, or other intellectual property rights that relate to the pres ented subject matter. the furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. intel may make changes to specifications and pr oduct descriptions at any time, without notice. designers must not rely on the absence or characteristi cs of any features or instru ctions marked ?reserved? or ?undefined.? intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. intel desktop boards may contain desi gn defects or errors known as errata, which may cause the product to deviate from published specifications. current ch aracterized errata are available on request. contact your local intel sales office or your distributor to obtain the latest specifications before placing your product order. copies of documents which have an ordering number and are referenced in this document, or other intel literature, may be obtained from: intel corporation p.o. box 5937 denver, co 80217-9808 or call in north america 1-800-548-4725, europe 44-0-1793-431-155, france 44-0-1793-421-777, germany 44-0-1793-421-333, other countries 708-296-9333. intel, pentium, and celeron are registered trademarks of intel corporation or its subsidiaries in the united states and other countries. * other names and brands may be cl aimed as the property of others. copyright ? 2008, intel corporation. all rights reserved. iii preface this technical product specification (tps) specifies the board layout, components, connectors, power and environmental requirements, and the bios for the intel ? desktop board DX58SO. intended audience the tps is intended to provide detailed, technical information about the intel desktop board DX58SO and its components to the ve ndors, system integrators, and other engineers and technicians who need this level of information. it is specifically not intended for general audiences. what this document contains chapter description 1 a description of the hardware used on the intel desktop board DX58SO 2 a map of the resources of the intel desktop board 3 the features supported by the bios setup program 4 a description of the bios error messages, beep codes, and post codes 5 regulatory compliance and battery disposal information typographical conventions this section contains information about the conventions used in this specification. not all of these symbols and abbreviations appear in all specifications of this type. notes, cautions, and warnings note notes call attention to important information. # integrator?s notes integrator?s notes are used to call attentio n to information that may be useful to system integrators. caution cautions are included to help you avoid damaging hardware or losing data. intel desktop board DX58SO technical product specification iv other common notation # used after a signal name to identify an active-low signal (such as usbp0#) gb gigabyte (1,073,741,824 bytes) gb/sec gigabytes per second gbits/sec gigabits per second kb kilobyte (1024 bytes) kbit kilobit (1024 bits) kbits/sec 1000 bits per second mb megabyte (1,048,576 bytes) mb/sec megabytes per second mbit megabit (1,048,576 bits) mbits/sec megabits per second xxh an address or data value ending with a lowercase h indicates a hexadecimal value. x.x v volts. voltages are dc unless otherwise specified. * this symbol is used to indicate third-party brands and names that are the property of their respective owners. v contents 1 product desc ription .............................................................. 9 1.1 overview.......................................................................................... 9 1.1.1 feature summary .................................................................. 9 1.1.2 board layout ....................................................................... 11 1.1.3 block diagram ..................................................................... 13 1.2 legacy considerations............. ......................................................... 14 1.3 online support................................................................................ 14 1.4 processor ....................................................................................... 14 1.5 system memory .............................................................................. 15 1.5.1 memory configurations ......... ................................................ 16 1.6 intel ? x58 chipset ........................................................................... 18 1.6.1 usb ................................................................................... 18 1.6.2 serial ata interfaces ............................................................ 19 1.7 discrete esata controller ................................................................. 20 1.7.1 external serial ata support ................................................... 20 1.8 real-time clock subsystem ............ .................................................. 20 1.9 legacy i/o controller ....................................................................... 21 1.9.1 consumer infrared (cir) ....................................................... 21 1.10 audio subsystem............................................................................. 22 1.10.1 audio subsystem software .................................................... 22 1.10.2 audio connectors and headers ............................................... 22 1.10.3 8-channel (7.1) audio subsyste m........................................... 23 1.11 lan subsystem ............................................................................... 24 1.11.1 intel ? 82567lm gigabit ethernet controller .............................. 24 1.11.2 lan subsystem software....................................................... 25 1.11.3 rj-45 lan connector with integrated leds .............................. 25 1.12 hardware management subsystem .................................................... 26 1.12.1 hardware monitoring and fan control...................................... 26 1.12.2 fan monitoring ..................................................................... 26 1.12.3 chassis intrusion and detection.............................................. 26 1.12.4 thermal monitoring .............................................................. 27 1.13 power management ......................................................................... 28 1.13.1 acpi................................................................................... 28 1.13.2 hardware support ................................................................ 32 1.14 onboard power button ..................................................................... 36 1.14.1 energy star* .................................................................... 37 2 technical re ference ............................................................ 39 2.1 memory resources .......................................................................... 39 2.1.1 addressable memory............................................................. 39 2.1.2 memory map........................................................................ 41 2.2 connectors and headers................................................................... 41 2.2.1 back panel connectors .......................................................... 42 intel desktop board DX58SO technical product specification vi 2.2.2 component-side connectors and headers ................................ 43 2.3 jumper block .................................................................................. 53 2.4 mechanical considerations ........... ..................................................... 55 2.4.1 form factor......................................................................... 55 2.5 electrical considerations ........... ........................................................ 56 2.5.1 power supply considerations ................................................. 56 2.5.2 fan header current capability................................................ 57 2.5.3 add-in board considerations .. ................................................ 57 2.6 thermal considerations .................................................................... 57 2.7 reliability ....................................................................................... 60 2.8 environmental ................................................................................ 60 3 overview of bi os features ................................................. 61 3.1 introduction ................................................................................... 61 3.2 bios flash memory organization .. ..................................................... 62 3.3 resource configuration ............ ........................................................ 62 3.3.1 pci autoconfiguration ........................................................... 62 3.4 system management bios (smbios)................................................. 63 3.5 legacy usb support ........................................................................ 63 3.6 bios updates ................................................................................. 64 3.6.1 language support ................................................................ 64 3.6.2 custom splash screen .......................................................... 65 3.7 bios recovery................................................................................ 65 3.8 boot options................................................................................... 66 3.8.1 cd-rom boot ...................................................................... 66 3.8.2 network boot....................................................................... 66 3.8.3 booting without attached devices........................................... 66 3.8.4 changing the default boot device during post ........................ 66 3.9 adjusting boot speed....................................................................... 67 3.9.1 peripheral selection and conf iguration..................................... 67 3.9.2 bios boot optimizations ....... ................................................ 67 3.10 bios security features .................................................................... 68 3.11 bios performance features ............ .................................................. 69 4 error messages an d beep codes ......................................... 71 4.1 speaker ......................................................................................... 71 4.2 bios beep codes ............................................................................ 71 4.3 bios error messages ....................................................................... 71 4.4 port 80h post codes ....................................................................... 72 5 regulatory compliance and battery disposal information .. 77 5.1 regulatory compliance..................................................................... 77 5.1.1 safety standards.................................................................. 77 5.1.2 european union declaration of conformity statement ................ 78 5.1.3 product ecology statements................................................... 79 5.1.4 emc regulations .................................................................. 83 5.1.5 product certification markings (b oard level)............................. 84 5.2 battery disposal information........ ..................................................... 85 contents vii figures figure 1. major board components.... ........................................................... 11 figure 2. block diagram............... ............................................................... 13 figure 3. memory channel and dimm configuration ........................................ 17 figure 4. back panel audio connector options................................................ 23 figure 5. lan connector led locations ......................................................... 25 figure 6. thermal sensors and fan headers .................................................. 27 figure 7. locations of indicator leds ............................................................ 35 figure 8. location of the onboard power button ............................................. 36 figure 9. detailed system memory a ddress map............................................. 40 figure 10. back panel connectors...... ........................................................... 42 figure 11. component-side connectors and headers....................................... 43 figure 12. connection diagram for front panel header .................................... 50 figure 13. connection diagram for front panel usb headers............................ 52 figure 14. connection diagram for ieee 1394a header.................................... 52 figure 15. location of the jumper bl ock ........................................................ 53 figure 16. board dimensions ....................................................................... 55 figure 17. localized high temperature zones ................................................ 58 tables table 1. feature summary ............................................................................ 9 table 2. components shown in figure 1........................................................ 12 table 3. supported memory configurat ions.................................................... 16 table 4. lan connector led states .............................................................. 25 table 5. effects of pressing the powe r switch................................................. 29 table 6. power states and targeted system power ......................................... 30 table 7. wake-up devices and events ........................................................... 31 table 8. system memory map...................................................................... 41 table 9. component-side connectors and headers shown in figure 11 .............. 44 table 10. hd audio link header................................................................... 45 table 11. front panel audio header .............................................................. 45 table 12. serial ata connectors .................................................................. 45 table 13. chassis intrusion header .............................................................. 46 table 14. front and rear chassis (3-pin) fan headers..................................... 46 table 15. processor and rear chassis 2 (4-pin) fan headers ............................ 46 table 16. auxiliary front panel power/sleep led header ................................. 47 table 17. processor core power conne ctor .................................................... 48 table 18. main power connector .................................................................. 49 table 19. auxiliary pci express grap hics power connector............................... 49 table 20. front panel header....................................................................... 50 table 21. states for a one-color powe r led .................................................. 51 table 22. states for a two-color powe r led .................................................. 51 table 23. bios setup configuration jumper settings ...................................... 54 table 24. recommended power supply current values.................................... 56 intel desktop board DX58SO technical product specification viii table 25. fan header current capability ....................................................... 57 table 26. thermal considerations fo r components.......................................... 59 table 27. environmental specifications ......................................................... 60 table 28. bios setup program menu ba r ...................................................... 62 table 29. bios setup program functi on keys ................................................ 62 table 30. acceptable drives/media types for bios recovery ............................ 65 table 31. boot device menu options.. ........................................................... 66 table 32. supervisor and user passwor d functions ......................................... 68 table 33. beep codes................................................................................. 71 table 34. bios error messages .................................................................... 71 table 35. port 80h post code ranges .......................................................... 72 table 36. port 80h post codes...... .............................................................. 73 table 37. typical port 80h post sequ ence .................................................... 76 table 38. safety standards ......................................................................... 77 table 39. lead-free board markings ............................................................. 82 table 40. emc regulations .......................................................................... 83 table 41. product certification markin gs........................................................ 84 9 1 product description 1.1 overview 1.1.1 feature summary table 1 summarizes the major features of the board. table 1. feature summary form factor atx (12.00 inches by 9.60 inches [ 304.80 millimeters by 243.84 millimeters]) processor ? intel ? core? i7 processor in an lga1366 socket memory ? four 240-pin ddr3 sdram dual inline memory module (dimm) sockets ? support for ddr3 1333 mhz, ddr3 1066 mhz, and ddr3 800 mhz dimms ? support for up to 16 gb of system memory ? support for non-ecc memory ? xmp version 1.2 chipset intel ? x58 chipset, consisting of: ? intel ? x58 i/o hub (ioh) ? intel ? 82801ijr i/o controller hub (ich10r) audio intel ? high definition audio subsystem using the realtek* alc889 audio codec. legacy i/o control winbond legacy i/o controller for consumer infrared (cir) peripheral interfaces ? twelve usb 2.0 ports ? six internal serial ata interfaces with raid support ? two external serial ata (esata) ports on back panel with raid support ? two ieee 1394a ports (one on back panel, one front-panel header) bios ? intel ? bios resident in the spi flash device ? support for advanced configuration and power interface (acpi), plug and play, and smbios instantly available pc technology ? support for pci local bus specification revision 2.2 ? support for pci express* revision 2.0 ? suspend to ram support ? wake on pci, front panel, cir, and usb ports lan support gigabit (10/100/1000 mbits/sec) lan subsystem using the intel ? 82567lm gigabit ethernet controller continued intel desktop board DX58SO technical product specification 10 table 1. feature summary (continued) expansion capabilities ? one pci* conventional bus add-in ca rd connector (smbus routed to pci conventional bus add-in card connector) ? two pci express 2.0 x16 bus add-in card connectors ? one pci express 2.0 x4 bus add-in card connector ? two pci express 1.1 x1 bus add-in card connectors hardware monitor subsystem ? hardware monitoring and fan control asic ? voltage sense to detect out of range power supply voltages ? thermal sense to detect out of range thermal values ? four fan headers using pwm control ? three fan sense inputs used to monitor fan activity ? fan speed control using voltage contro l (3-pin fan headers front and rear) ? support for product environmen tal control interface (peci) product description 11 1.1.2 board layout figure 1 shows the location of the major components on intel desktop board DX58SO. figure 1. major board components table 2 lists the components identified in figure 1. intel desktop board DX58SO technical product specification 12 table 2. components shown in figure 1 item/callout from figure 1 descript ion a auxiliary fan b pci express x1 connector c pci express x16 bus add-in card connector (secondary) d front panel audio header e pci conventional bus add-in card connector f pci express x1 bus add-in card connector g pci express x16 bus add-in card connector (primary) h pci express x4 bus add-in card connector i auxiliary pci express graphics power connector j back panel connectors k processor fan header l rear fan header m lga1366 processor socket n dimm channel a sockets [2] o dimm channel b socket p dimm channel c socket q main power connector r i/o hub fan header s intel 82x58 io hub (ioh) t processor core power connector (2 x 4) u chassis intrusion header v front chassis fan header w serial ata connectors [6] x front panel usb headers [2] y battery z intel 82801ijr i/o controller hub (ich10r) aa ieee 1394a front panel header bb onboard power button cc bios setup configuration jumper block dd auxiliary front panel power led header ee front panel cir receiver (input) header ff back panel cir emitter (output) header gg front panel header hh high definition audio link header ii sata power connector jj s/pdif connector product description 13 1.1.3 block diagram figure 2 is a block diagram of the majo r functional areas of the board. figure 2. block diagram intel desktop board DX58SO technical product specification 14 1.2 legacy considerations this board differs from other intel deskto p board products, with specific changes including (but not limited to) the following: ? no parallel port ? no floppy drive connector ? no serial port ? no ps/2 connectors 1.3 online support to find information about? visit this world wide web site: intel ? desktop board DX58SO http://www.intel.com/products/m otherboard/DX58SO/index.htm desktop board support http://support.intel.com/support/motherboards/desktop/DX58SO available configurations for the intel desktop board DX58SO http://www.intel.com/products/m otherboard/DX58SO/index.htm supported processors http://www.intel.com/go/findcpu chipset information http://www.intel.com/products/d esktop/chipsets/index.htm bios and driver updates http://downloadcenter.intel.com/ 1.4 processor the board is designed to suppo rt the following processor: ? intel core i7 processor in an lga1366 socket other processors may be supported in the fu ture. this board is designed to support processors with a maximum wattage of 130 w. the processor listed above is only supported when falling within the wattage requirements of the intel desktop board DX58SO. see the intel web site listed below for the most up-to-date list of supported processors. for information about? refer to: supported processors http://processormatch.intel.com caution use only the processors listed on the web site above. use of unsupported processors can damage the board, the proce ssor, and the power supply. # integrator?s note this board has specific requirements for pr oviding power to the processor. refer to section 2.5.1 on page 56 for information on power supply requirements for this board. product description 15 1.5 system memory the board has four dimm sockets and su pports the following memory features: ? 1.5 v ddr3 sdram dimms ? three independent memory channels with interleaved mode support ? unbuffered, single-sided or double-sided dimms with the following restriction: double-sided dimms with x16 organization are not supported. ? 16 gb maximum total system memory. refer to section 2.1.1 on page 39 for i nformation on the total amo unt of addressable memory. ? minimum total system memory: 1 gb ? non-ecc dimms ? serial presence detect ? ddr3 1333 mhz, ddr3 1066 mhz, and ddr3 800 mhz sdram dimms ? xmp version 1.2 performance profile su pport for memory speeds above 1333 mhz note to be fully compliant with all applicable ddr sdram memory specifications, the board should be populated with dimms that support the serial presence detect (spd) data structure. this allows the bios to read the spd data and program the chipset to accurately configure memory settings for op timum performance. if non-spd memory is installed, the bios will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the dimms may not function under the determined frequency. intel desktop board DX58SO technical product specification 16 table 3 lists the supported dimm configurations. table 3. supported memory configurations dimm capacity configuration (note 1) sdram density sdram organization front-side/back-side number of sdram devices (note 2) 1024 mb ss 1 gbit 128 m x 8/empty 8 [9] 2048 mb ds 1 gbit 128 m x 8/128 m x 8 16 [18] notes: 1. in the second column, ?ds? refers to double-sided memory modules (containing two rows of sdram) and ?ss? refers to single-sided memory modules (containing one row of sdram). 2. in the fifth column, the number in brackets specifies the number of sdram devices on an ecc dimm. for information about? refer to: tested memory http://support.intel.com/support/motherboards/desktop/sb/cs- 025414.htm xmp tested memory http://www.intel.com/personal /gaming/extremememory.htm 1.5.1 memory configurations the intel core i7 processor supports the following types of me mory organization: ? tri/dual channel (interleaved) mode . this mode offers the highest throughput for real world applications. interleaving reduces overall memory latency by accessing the dimm memory sequ entially. data is spread amongst the memory modules in an alternating pattern. ? three independent memory channels give two possible modes of interleaving: ? tri-channel mode is enabled when identical matched memory modules are installed in each of the three memo ry channels (blue connectors). ? dual channel mode is enabled when tw o of the blue memory connectors are populated with matched dimms. ? single channel (asymmetric) mode . this mode is equivalent to single channel bandwidth operation for real world applications. this mode is used when only a single dimm is installed or the installed memory modules are not matched. technology and device wi dth can vary from one channel to the other. for information about? refer to: memory configuration examples http://www.intel.com/support/m otherboards/desktop/sb/cs- 011965.htm figure 3 illustrates the memory channel and dimm configuration. product description 17 figure 3. memory channel and dimm configuration intel desktop board DX58SO technical product specification 18 1.6 intel ? x58 chipset the intel x58 chipset consists of the following devices: ? intel 82x58 ioh with direct medi a interface (dmi) interconnect ? intel 82801ijr i/o controller hub (ich10r) the ioh component provides interfaces to the processor and the pci express graphics connectors. the ich10r is a centralized controller for the board?s i/o paths. for information about refer to the intel x58 chipset http://www.intel.com/products/d esktop/chipsets/index.htm resources used by the chipset chapter 2 1.6.1 usb the board supports up to twelve usb 2.0 ports, supports uhci and ehci, and uses uhci- and ehci-compatible drivers. the ich10r provides the usb controller for all ports. the port arrangement is as follows: ? eight ports are implemented with dual stacked back pa nel connectors adjacent to the audio connectors ? four ports are routed to two se parate front panel usb headers for information about refer to the location of the usb connectors on the back panel figure 10, page 42 the location of the front panel usb headers figure 11, page 43 product description 19 1.6.2 serial ata interfaces the board provides six serial ata (sata) connectors, which support one device per connector. the board also provides two re d-colored external serial ata (esata) connectors on the back panel. 1.6.2.1 serial ata support the board?s serial ata controller offers six independent serial ata ports with a theoretical maximum transfer rate of 3 gbits/ sec per port. one device can be installed on each port for a maximum of six serial ata devices. a point-to-point interface is used for host to device connections, unlike parallel ata ide which supports a master/slave configuration an d two devices per channel. for compatibility, the underlying serial ata functionality is transparent to the operating system. the serial ata controlle r can operate in both legacy and native modes. in legacy mode, standard ide i/ o and irq resources are assigned (irq 14 and 15). in native mode, standard pci conv entional bus resource steering is used. native mode is the preferred mode for co nfigurations using the windows* xp and windows vista* operating systems. note many serial ata drives use new low-voltag e power connectors and require adapters or power supplies equipped with lo w-voltage power connectors. for more information, see: http://www.serialata.org/ . for information about refer to the location of the serial ata connectors figure 11, page 43 1.6.2.2 serial ata raid the board supports the following raid (r edundant array of independent drives) levels via the ich10r: ? raid 0 - data striping ? raid 1 - data mirroring ? raid 0+1 (or raid 10) - data striping and mirroring ? raid 5 - distributed parity note in order to use supported raid features, you must first enable raid in the bios. also, during microsoft windows xp installation, you must press f6 to install the raid drivers. see your microsoft windows xp documentation for more information about installing drivers during installation. intel desktop board DX58SO technical product specification 20 1.7 discrete esata controller the board provides a discrete marvell* cont roller to support two esata connectors on the back panel. 1.7.1 external serial ata support the red serial ata connectors on the back panel can be used for an external sata drive. they can also be used for port replication, which allows the aggregation of multiple hard drives on each of the esata ports. figure 10 on page 42 shows the l ocation of the external serial ata-comp atible sata ports on the back panel. the marvell 88se621 controller uses the pci express bus for data transfer with a theoretical maximum transfer rate of 3 gb its/sec per port. these connectors are in addition to the six sat a connectors of the ich10r sata interface. the discrete sata interface support s the following raid levels: ? raid 0 ? raid 1 note the marvell 88se621 controller supports single drive non-raid configurations as well as raid configurations. for raid configurat ions, you must install the raid drivers by pressing f6 during operating system in stallation. see your operating system installation documentation fo r more information about installing drivers during the installation process. for information about refer to the location of the discrete sata raid connectors figure 11, page 43 1.8 real-time clock subsystem a coin-cell battery (cr2032) powers the real-time clock and cmos memory. when the computer is not plugged into a wall so cket, the battery has an estimated life of three years. when the computer is plu gged in, the standby current from the power supply extends the life of the battery. the clock is accurate to 13 minutes/year at 25 oc with 3.3 vsb applied. note if the battery and ac power fail date and time values will be reset and the user will be notified during post. when the voltage drops below a certain leve l, the bios setup program settings stored in cmos ram (for example, the date and time) might not be accurate. replace the battery with an equivalent one. figure 1 on page 11 shows the location of the battery. product description 21 1.9 legacy i/o controller the i/o controller provides the following features: ? consumer infrared (cir) headers ? serial irq interface compatible with serialized irq support for pci systems ? intelligent power management, including a programmable wake-up event interface ? pci power management support the bios setup program provides configuration options for the i/o controller. 1.9.1 consumer infrared (cir) the consumer infrared (cir) feature is desi gned to comply with microsoft consumer infrared usage models. microsoft windows vista is the supported operating system the cir feature is made up of two separate pieces: the receiving (receiver) header, and the output (emitter) header. the receivin g header consists of a filtered translated infrared input compliant with microsoft cir specifications, and also a ?learning? infrared input. this learning input is simply a high pass input which the computer can use to ?learn? to speak the infrared communi cation language of other user remotes. the emitter header consists of two output ports which the pc can use to emulate ?learned? infrared commands in order to control external electronic hardware. customers are required to buy or create thei r own interface modules to plug into intel desktop boards for this feature to work. intel desktop board DX58SO technical product specification 22 1.10 audio subsystem the board supports the intel high definition au dio subsystem based on the realtek alc889 audio codec. the audio subsys tem supports the following features: ? advanced jack sense for the back panel au dio jacks that enables the audio codec to recognize the device that is connected to an audio port. the back panel audio jacks are capable of retasking accordin g to user?s definition, or can be automatically switched depending on the recognized device type. ? stereo input and output for all back panel jacks ? line out and mic in function s for front panel audio jacks ? a signal-to-noise (s/n) ratio of 90 db 1.10.1 audio subsystem software audio software and drivers are availabl e from intel?s worl d wide web site. for information about refer to obtaining audio software and drivers section 1.3, page 14 1.10.2 audio connectors and headers the board contains audio connectors and he aders on both the back panel and the component side of the board. the co mponent-side audio headers include the following: ? front panel audio (a 2 x 5-pin header that provides mic in and line out signals for front panel audio connectors) ? high definition (hd) audio link header (a 2 x 8-pin header for s/pdif) used for hdmi video cards ? s/pdif audio connector (1 x 3-pin connect or) can be used for hdmi video cards that do not work with the hd audio header ? s/pdif output between the back panel op tical connector and the internal s/pdif header can be selected in bios setup for information about refer to the locations of the front panel audi o header, hd audio link header, and s/pdif audio connector figure 11, page 43 the signal names of the front panel audio header table 11, page 45 the back panel audio connectors section 2.2.1, page 42 product description 23 1.10.3 8-channel (7.1) audio subsystem the 8-channel (7.1) audio subsystem includes the following: ? intel 82801ijr (ich10r) ? realtek alc889 audio codec ? microphone input that supports a single dynamic, condenser, or electret microphone the back panel audio connectors are configur able through the audio device drivers. the available configurable audio ports are shown in figure 4. item description a surround left/right channel audio out/retasking jack b center channel and lfe (subwoofer) audio out c line in (side channel surround) audio out/retasking jack) d line out/headphone (stereo) e mic in f s/pdif digital audio out (optical) figure 4. back panel audio connector options for information about refer to the back panel audio connectors section 2.2.1, page 42 intel desktop board DX58SO technical product specification 24 1.11 lan subsystem the lan subsystem consists of the following: ? intel 82567lm gigabit ethernet co ntroller (10/100/1000 mbits/sec) ? intel 82801ijr (ich10r) ? rj-45 lan connector with integrated status leds additional features of the lan subsystem include: ? csma/cd protocol engine ? lan connect interface between ich10r and the lan controller ? pci conventional bu s power management ? acpi technology support ? lan wake capabilities ? lan subsystem software for information about refer to lan software and drivers http://downloadcenter.intel.com 1.11.1 intel ? 82567lm gigabit ethernet controller the intel 82567lm gigabit ethernet contro ller supports the following features: ? pci express link ? 10/100/1000 ieee 802.3 compliant ? compliant to ieee 802.3x flow control support ? 802.1p and 802.1q ? tcp, ip, and udp checksum offload (for ipv4 and ipv6) ? transmit tcp segmentation ? full device driver compatibility ? pci express power management support product description 25 1.11.2 lan subsystem software lan software and drivers are available from intel?s worl d wide web site. for information about refer to obtaining lan software and drivers http://downloadcenter.intel.com 1.11.3 rj-45 lan connector with integrated leds two leds are built into the rj-45 lan connector (shown in figure 5 below). item description a link led (green) b data rate led (green/yellow) figure 5. lan connector led locations table 4 describes the led states when the board is powered up and the lan subsystem is operating. table 4. lan connector led states led led color led state condition off lan link is not established. on lan link is established. link green blinking lan activity is occurring off 10 mbits/sec data rate is selected. green 100 mbits/sec data rate is selected. data rate green/yellow yellow 1000 mbits/sec data rate is selected. intel desktop board DX58SO technical product specification 26 1.12 hardware management subsystem the hardware management features enable th e board to be compatible with the wired for management (wfm) specification. th e board has several hardware management features, including the following: ? fan monitoring and control ? thermal and voltage monitoring ? chassis intrusion detection 1.12.1 hardware monitoring and fan control the features of the hardware monitoring and fan control include: ? fan speed control controllers and sensors provided by the hardware monitoring and fan control asic ? thermal sensors in the processo r, 82x58 ioh, and 82801ijr ich10r ? power supply monitoring of five voltages (+5 v, +12 v, +3.3 vsb, +1.1 v, and +vccp) to detect levels above or below acceptable values ? thermally monitored closed-loop fan control, for all three fans, that can adjust the fan speed or switch the fans on or off as needed 1.12.2 fan monitoring fan monitoring can be implemented using intel ? desktop control center or third-party software. for information about refer to the functions of the fan headers section 1.13.2.2, page 33 1.12.3 chassis intrusion and detection the board supports a chassis security featur e that detects if the chassis cover is removed. the security feature uses a mechan ical switch on the chassis that attaches to the chassis intrusion header. when the chassis cover is removed, the mechanical switch is in the closed position. for information about refer to the location of the ch assis intrusion header figure 11, page 43 product description 27 1.12.4 thermal monitoring figure 6 shows the locations of th e thermal sensors and fan headers. item description a auxiliary rear chassis fan b processor fan c rear fan d thermal diode, located on processor die e ioh fan f thermal diode, located on the ioh die g front chassis fan h thermal diode, located on the ich10r die figure 6. thermal sensors and fan headers intel desktop board DX58SO technical product specification 28 1.13 power management power management is implemented at several levels, including: ? software support through advanced conf iguration and power interface (acpi) ? hardware support: ? power connector ? fan headers ? lan wake capabilities ? instantly available pc technology ? wake from usb ? power management event sign al (pme#) wake-up support ? pci express wake# signal support 1.13.1 acpi acpi gives the operating system direct co ntrol over the power management and plug and play functions of a computer. the us e of acpi with this board requires an operating system that provides full acpi support. acpi features include: ? plug and play (including bus and device enumeration) ? power management control of individual devices, add-in boards (some add-in boards may require an acpi-aware driver), video displays, and hard disk drives ? methods for achieving less than 15-watt syst em operation in the power-on/standby sleeping state ? a soft-off feature that enables the operating system to power-off the computer ? support for multiple wake-up events (see table 7 on page 31) ? support for a front panel power and sleep mode switch product description 29 table 5 lists the system states based on how long the power switch is pressed, depending on how acpi is configured with an acpi-aware operating system. table 5. effects of pressing the power switch if the system is in this state? ?and the power switch is pressed for ?the system ente rs this state off (acpi g2/g5 ? soft off) less than four seconds power-on (acpi g0 ? working state) on (acpi g0 ? working state) less than four seconds soft-off/standby (acpi g1 ? sleeping state) on (acpi g0 ? working state) more than six seconds fail safe power-off (acpi g2/g5 ? soft off) sleep (acpi g1 ? sleeping state) less than four seconds wake-up (acpi g0 ? working state) sleep (acpi g1 ? sleeping state) more than six seconds power-off (acpi g2/g5 ? soft off) 1.13.1.1 system states and power states under acpi, the operating system direct s all system and device power state transitions. the operating system puts de vices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. devices that are not being used can be tu rned off. the operating system uses information from applications and user setti ngs to put the system as a whole into a low-power state. intel desktop board DX58SO technical product specification 30 table 6 lists the power states supported by the board along with the associated system power targets. see the ac pi specif ication for a complete description of the various system and power states. table 6. power states and targeted system power global states sleeping states processor states device states targeted system power (note 1) g0 ? working state s0 ? working c0 ? working d0 ? working state. full power > 30 w g1 ? sleeping state s1 ? processor stopped c1 ? stop grant d1, d2, d3 ? device specification specific. 5 w < power < 52.5 w g1 ? sleeping state s3 ? suspend to ram. context saved to ram. no power d3 ? no power except for wake-up logic. power < 5 w (note 2) g1 ? sleeping state s4 ? suspend to disk. context saved to disk. no power d3 ? no power except for wake-up logic. power < 5 w (note 2) g2/s5 s5 ? soft off. context not saved. cold boot is required. no power d3 ? no power except for wake-up logic. power < 5 w (note 2) g3 ? mechanical off ac power is disconnected from the computer. no power to the system. no power d3 ? no power for wake-up logic, except when provided by battery or external source. no power to the system. service can be performed safely. notes: 1. total system power is dependent on the system conf iguration, including add-in boards and peripherals powered by the system chassis? power supply. 2. dependent on the standby power consumption of wake-up devices used in the system. product description 31 1.13.1.2 wake-up devices and events table 7 lists the devices or specific events that can wake the computer from specific states. table 7. wake-up devices and events these devices/events can wake up the computer? ?from this state lan s1, s3, s4, s5 (note 1) pme# signal s1, s3, s4, s5 (note 1) power switch s1, s3, s4, s5 rtc alarm s1, s3, s4, s5 usb s1, s3 wake# s1, s3, s4, s5 consumer ir s1, s3 (s4 and s5) (note 2) note 1: for lan and pme# signal, s5 is disabled by default in the bios setup program. setting this option to power on will enable a wake-up event from lan in the s5 state. note 2: wake from s4 and s5 is optional by the specification. note the use of these wake-up events from an acpi state requires an operating system that provides full acpi support. in additi on, software, drivers, and peripherals must fully support acpi wake events. intel desktop board DX58SO technical product specification 32 1.13.2 hardware support caution ensure that the power supply provides adeq uate +5 v standby current if lan wake capabilities and instantly available pc technolo gy features are used. failure to do so can damage the power supply. the total am ount of standby current required depends on the wake devices supported and manufacturing options. the board provides several power manage ment hardware features, including: ? power connector ? fan headers ? lan wake capabilities ? instantly available pc technology ? wake from usb ? pme# signal wake-up support ? wake# signal wake-up support ? wake from consumer ir lan wake capabilities and instantly available pc technology require power from the +5 v standby line. note the use of wake from usb from an acpi state requires an operating system that provides full acpi support. 1.13.2.1 power connector atx12v-compliant power supplies can turn off the system power through system control. when an acpi-enabled system receives the correct command, the power supply removes all non-standby voltages. when resuming from an ac power failure, th e computer returns to the power state it was in before power was interrupted (on or off). the computer?s response can be set using the last power state feature in th e bios setup program?s boot menu. for information about refer to the location of the main power connector figure 11, page 43 the signal names of the main power connector table 18, page 49 product description 33 1.13.2.2 fan headers the function/operation of the fan headers is as follows: ? the fans are on when the boar d is in the s0 or s1 state. ? the fans are off when the board is off or in the s3, s4, or s5 state. ? each fan header is wired to a fan tachomet er input of the hardware monitoring and fan control asic, except the fan he ader located at j7th (item r on figure 1, page 11) ? all fan headers support closed-loop fan co ntrol that can adjust the fan speed or swi tch the fan on or off as needed ? all fan headers have a +12 v dc connection ? 4-pin fan headers are controlled by pulse width modulation ? 3-pin fan headers (front and rear) are modulated by voltage control for information about refer to the location of the fan headers figure 11, page 43 the location of the fan headers an d sensors for thermal monitoring figure 6, page 27 the signal names of the fan headers section 0, page 42 1.13.2.3 lan wake capabilities caution for lan wake capabilities, the +5 v standby line for the power supply must be capable of providing adequate +5 v standby current . failure to provide adequate standby current when implementing lan wake capa bilities can damage the power supply. lan wake capabilities enable remote wake-up of the computer through a network. the lan subsystem pci bus network adapter monitors network traffic at the media independent interface. upon detecting a magic packet* frame, the lan subsystem asserts a wake-up signal th at powers up the computer. depending on the lan implementation, the board supports lan wake capabilities with acpi in the following ways: ? the pci express wake# signal ? the pci bus pme# signal for pci 2.3 compliant lan designs ? by ping ? magic packet ? the onboard lan subsystem ? wake from cir intel desktop board DX58SO technical product specification 34 1.13.2.4 instantly available pc technology caution for instantly available pc technology, th e +5 v standby line for the power supply must be capable of providing adequate +5 v standby current. failure to provide adequate standby current when implementing instantly available pc technology can damage the power supply. instantly available pc technology enables the board to enter the acpi s3 (suspend-to- ram) sleep-state. while in the s3 sleep-state, the computer will appear to be off (the power supply is off, and the front panel led is amber if dual colored, or off if single colored.) when signaled by a wake-up device or event, the system quickly returns to its last known wake state. table 7 on page 31 lists the devices and events that can wake the computer from the s3 state. the board supports the pc i bus power management interface specification . add-in boards that also support this specificatio n can participate in power management and can be used to wake the computer. the use of instantly available pc technolo gy requires operating system support and pci 2.2 compliant add-in cards, pci express add-in cards, and drivers. 1.13.2.5 wake from usb usb bus activity wakes the comput er from acpi s1 or s3 states. note wake from usb requires the use of a usb peripheral that supports wake from usb. 1.13.2.6 pme# signal wake-up support when the pme# signal on the pci conventi onal bus is asserted, the computer wakes from an acpi s1, s3, s4, or s5 state (w ith wake on pme enabled in the bios). 1.13.2.7 wake# signal wake-up support when the wake# signal on the pci express bus is asserted, the computer wakes from an acpi s1, s3, s4, or s5 state. product description 35 1.13.2.8 +5 v standby power indicator led and additional leds the +5 v standby power indicator led shows that power is still present even when the computer appears to be off. figure 7 shows the locati on of the standby power indicator led on the board. caution if ac power has been switched off and the standby power indicators are still lit, disconnect the power cord befo re installing or removing an y devices connected to the board. failure to do so could damage the board an d any attached devices. in addition to the standby power indicator, the board contains two leds that indicate the following: ? the processor led indicates an elevated temperature on the processor that could effect performance ? the voltage regulator led indicates an elevated temperature in the processor voltage regulator circuit that could effect performance figure 7 shows the location of these additional leds. item description a voltage regulator led (red) b standby power indicator led (green) c processor led (red) d hard drive activity led (green) figure 7. locations of indicator leds intel desktop board DX58SO technical product specification 36 1.14 onboard power button the board provides a power button that can be used to turn the computer on or off. this button is intended for use at integration facilities to remove standby power before making changes to the system configur ation, or for testing purposes. the power button on the front panel is recommended for all other instances of turning the computer on or off. to turn the co mputer off using the onboard power button, keep the button pressed down for three seconds. figure 8 shows the location of the onboard power button. figure 8. location of the onboard power button caution electrostatic discharge (esd) can damage components. the onboard power button should be used only at an esd workstat ion using an antistatic wrist strap and a conductive foam pad. if such a station is not available, some esd protection can be provided by wearing an antistatic wrist stra p and attaching it to a metal part of the computer chassis. product description 37 1.14.1 energy star* in 2007, the us department of energy and the us environmental protection agency revised the energy star* requirements. in tel has worked directly with these two governmental agencies to define the new re quirements. currently this intel desktop board meets the new category c requir ements when using the appropriate peripherals. for information about refer to energy star requirements and recommended configurations http://www.intel.com/go/energystar intel desktop board DX58SO technical product specification 38 39 2 technical reference 2.1 memory resources 2.1.1 addressable memory the board utilizes 16 gb of addressable system memory. typically the address space that is allocated for pci conventional bu s add-in cards, pci express configuration space, bios (spi flash device), and chipse t overhead resides above the top of dram (total system memory). on a system that has 16 gb of system memory installed, it is not possible to use all of the installed me mory due to system address space being allocated for other system critical function s. these functions include the following: ? bios/spi flash device (16 mbit) ? local apic (19 mb) ? direct media interface (40 mb) ? front side bus interrupts (17 mb) ? pci express configuration space (256 mb) ? ioh base address registers pc i express ports (up to 256 mb) ? memory-mapped i/o that is dynamically allocated for pci conventional and pci express add-in cards (256 mb) the board provides the capability to reclaim the physical memory overlapped by the memory mapped i/o logical address space. the board remaps physical memory from the top of usable dram boundary to the 4 gb boundary to an equivalent sized logical address range located just above the 4 gb boundary. figure 9 shows a schematic of the system memory map. all installed syst em memory can be used when there is no overlap of system addresses. intel desktop board DX58SO technical product specification 40 figure 9. detailed system memory address map technical reference 41 2.1.2 memory map table 8 lists the system memory map. table 8. system memory map address range (decimal) address range (hex) size description 1024 k - 16777216 k 100000 - 3ffffffff 16382 mb extended memory 960 k - 1024 k f0000 - fffff 64 kb runtime bios 896 k - 960 k e0000 - effff 64 kb reserved 800 k - 896 k c8000 - dffff 96 kb potential available high dos memory (open to the pci conventional bus). dependent on video adapter used. 640 k - 800 k a0000 - c7fff 160 kb video memory and bios 639 k - 640 k 9fc00 - 9ffff 1 kb extended bios data (movable by memory manager software) 512 k - 639 k 80000 - 9fbff 127 kb extended conventional memory 0 k - 512 k 00000 - 7ffff 512 kb conventional memory 2.2 connectors and headers caution only the following connectors and headers ha ve overcurrent protection: back panel and front panel usb, as well as ieee 1394a. the other internal connectors and headers are not overcurrent protected and should connect only to devices inside the computer ?s chassis, such as fans and internal peripherals. do not use these connectors or headers to power devices external to the computer?s chassis. a fault in the load pr esented by the external devices could cause damage to the computer, the power cable, and the external devices themselves. furthermore, improper connection of usb or 1394 header single wire connectors may eventually overload the overcurrent protection and cause damage to the board. this section describes the board?s connector s. the connectors ca n be divided into these groups: ? back panel i/o connectors ? component-side i/o connectors and headers (see page 43) intel desktop board DX58SO technical product specification 42 2.2.1 back panel connectors figure 10 shows the location of the back panel connectors for the board. item description a esata ports b usb ports c usb ports d ieee-1394a connector e usb ports f lan g usb ports h center channel and lfe (subwoofer) audio out/retasking jack g i surround left/right channel audio out/retasking jack h j audio line in/(side surround) audio out/retasking jack c k front left/right channel audio out/two channel audio line out/retasking jack d l mic in m digital audio out optical figure 10. back panel connectors note the back panel audio line out connector is designed to power headphones or amplified speakers only. poor audio quality occurs if passive (non-amplified) speakers are connected to this output. technical reference 43 2.2.2 component-side connectors and headers figure 11 shows the locations of the co mponent-side connectors and headers. figure 11. component-side connectors and headers table 9 lists the component-side co nnectors and headers identified in figure 11. intel desktop board DX58SO technical product specification 44 table 9. component-side connectors and headers shown in figure 11 item/callout from figure 11 descript ion a auxiliary fan header b pci express x1 connector c pci express x16 bus add-in card connector d front panel audio header e pci conventional bus add-in card connector f pci express x1 bus add-in card connector g pci express x16 bus add-in card connector h pci express x4 bus add-in card connector i auxiliary pci express graphics power connector j processor fan header k rear fan header l main power connector m i/o hub fan header n processor core power connector (2 x 4) o chassis intrusion header p front chassis fan header q serial ata connectors [6] r front panel usb header s front panel usb header t ieee 1394a front panel header u auxiliary front panel power led header v front panel cir receiver (input) header w back panel cir emitter (output) header x front panel header y high definition audio link header z sata connector aa s/pdif connector technical reference 45 2.2.2.1 signal tables for the connectors and headers table 10. hd audio link header pin signal name pin signal name 1 bclk 2 ground 3 rst# 4 3.3 vcc 5 sync 6 ground 7 sdo 8 3.3 vcc 9 sdi0 10 +12 v 11 sdi1 12 key (no pin) 13 aud rsvd 14 3.3 v stby 15 aud rsvd 16 ground table 11. front panel audio header pin signal name pin signal name 1 [port 2] left channel 2 ground 3 [port 2] right channel 4 presence# (dongle present) 5 [port 1] right channel 6 [port 1] sense_return 7 sense_send (jack detection) 8 key (no pin) 9 [port 2] left channel 10 [port 2] sense_return table 12. serial ata connectors pin signal name 1 ground 2 txp 3 txn 4 ground 5 rxn 6 rxp 7 ground intel desktop board DX58SO technical product specification 46 table 13. chassis intrusion header pin signal name 1 intruder 2 ground table 14. front and rear chassis (3-pin) fan headers pin signal name 1 control (note) 2 +12 v 3 tach note: these fan headers use voltag e variance control for fan speed. table 15. processor and rear chassis 2 (4-pin) fan headers pin signal name 1 ground (note) 2 +12 v 3 fan_tach 4 fan_control note: these fan headers use pulse widt h modulation control for fan speed. table 20. back panel cir emitter (output) header pin signal name 1 emitter out 1 2 emitter out 2 3 ground 4 key (no pin) 5 jack detect 1 6 jack detect 2 table 21. front panel cir receiver (input) header pin signal name 1 ground 2 led 3 nc 4 learn-in 5 5 v standby 6 vcc 7 key (no pin) 8 cir input technical reference 47 2.2.2.2 add-in card connectors the board has the following add-in card connectors: ? pci express 2.0 x16: two pci ex press 2.0 x16 connectors supporting simultaneous transfer speeds up to 8 gb/ sec of peak bandwidt h per direction and up to 16 gb/sec concurrent bandwidth. ? pci express 2.0 x4: one pci express 2.0 x4 connector (implemented using a x4 physical connector capable of accepting a x16 card). the x4 interface supports simultaneous transfer speeds up to 250 mb /sec of peak bandwidth per direction and up to 5 gb/sec concurrent bandwidth. ? pci express 1.1 x1: two pci express 1. 1 x1 connectors. the x1 interface supports simultaneous transfer speeds up to 250 mb/sec of peak bandwidth per direction and up to 2 gb/sec concurrent bandwidth. ? pci conventional (rev 2.3 compliant) bus: one pci conventional bus add-in card connector. the smbus is routed to the pci conventional bus connector . pci conventional bus add-in cards with sm bus support can access sensor data and other information residing on the board. note the following considerations fo r the pci conventional bus connector: ? the pci conventional bus connector is bus master capable. ? smbus signals are routed to the pci conven tional bus connector. this enables pci conventional bus add-in boards with smbu s support to access sensor data on the board. the specific smbus signals are as follows: ? the smbus clock line is connected to pin a40. ? the smbus data line is connected to pin a41. 2.2.2.3 auxiliary front panel power/sleep led header pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel header. table 16. auxiliary front panel power/sleep led header pin signal name in/out description 1 hdr_blnk_grn out front panel green led 2 not connected 3 hdr_blnk_yel out front panel yellow led intel desktop board DX58SO technical product specification 48 2.2.2.4 power supply connectors the board has the following power supply connectors: ? main power ? a 2 x 12 connector. this connector is compatible with 2 x 10 connectors previously used on intel desk top boards. the board supports the use of atx12v power supplies with either 2 x 10 or 2 x 12 main power cables. when using a power supply with a 2 x 10 main po wer cable, attach that cable on the rightmost pins of the main power connector, leaving pins 11, 12, 23, and 24 unconnected. ? processor core power ? a 2 x 4 connector. this connector provides power directly to the processor voltage regulator and must always be used. failure to do so will prevent the board from booting. ? auxiliary pci express graphics power ? a 1 x 4 connector. this connector provides the required additional power wh en using high power (75 w or greater) add-in cards in either or both the seco ndary pci express x16 (electrical x8) and the pci express x16 (electrical x4) bus add-in card connectors. see figure 1 for locat ion. ? ?sata style? power connector ? an additional po wer connector for supplemental power which can be used in addition to or in place of the auxiliary pci express graphics power connector. caution if high power (75 w or greater) add-in cards are installed in either or both the secondary pci express x16 and the pci expr ess x4 bus add-in card connectors, the auxiliary pci express graphics power connector must be used. failure to do so may cause damage to the board and the add-in cards. table 17. processor core power connector pin signal name pin signal name 1 ground 2 +12 v 3 ground 4 +12 v 5 ground 6 +12 v 7 ground 8 +12 v technical reference 49 table 18. main power connector pin signal name pin signal name 1 +3.3 v 13 +3.3 v 2 +3.3 v 14 -12 v 3 ground 15 ground 4 +5 v 16 ps-on# (power supply remote on/off) 5 ground 17 ground 6 +5 v 18 ground 7 ground 19 ground 8 pwrgd (power good) 20 no connect 9 +5 v (standby) 21 +5 v 10 +12 v 22 +5 v 11 +12 v (note) 23 +5 v (note) 12 2 x 12 connector detect (note) 24 ground (note) note: when using a 2 x 10 power supply cable, this pin will be unconnected. table 19. auxiliary pci express graphics power connector pin signal name 1 +12 v 2 1 x 4 connector detect 3 ground 4 +5 v for information about refer to power supply considerations section 2.5.1 on page 56 intel desktop board DX58SO technical product specification 50 2.2.2.5 front panel header this section describes the functi ons of the front panel header. table 20 lists the signal names of the front panel header. figure 12 is a connection diagram for the front panel header. table 20. front panel header pin signal in/ out description pin signal in/ out description hard drive activity led power led 1 hd_pwr out hard disk led pull-up to +5 v 2 hdr_blnk_grn out front panel green led 3 hda# out hard disk active led 4 hdr_blnk_yel out front panel yellow led reset switch on/off switch 5 ground ground 6 fpbut_in in power switch 7 fp_reset# in reset switch 8 ground ground power not connected 9 +5 v power 10 n/c not connected figure 12. connection diagram for front panel header 2.2.2.5.1 hard drive activity led header pins 1 and 3 can be connected to an led to provide a visual indicator that data is being read from or written to a hard drive. proper led function requires one of the following: ? a serial ata hard drive or optical driv e connected to an onboard serial ata connector ? a parallel ata ide hard drive or optical drive connected to an onboard parallel ata ide connector technical reference 51 2.2.2.5.2 reset switch header pins 5 and 7 can be connected to a momentar y single pole, single throw (spst) type switch that is normally open. when the swit ch is closed, the board resets and runs the post. 2.2.2.5.3 power/sleep led header pins 2 and 4 can be connected to a one- or two-color led. table 21 shows the possible states for a one-color led. table 22 shows the possible states for a two-color led. table 21. states for a one-color power led led state description off power off/sleeping steady green running table 22. states for a two-color power led led state description off power off steady green running steady yellow sleeping note the colors listed in table 21 and table 22 are suggested colors only. actual led colors are chassis-specific. 2.2.2.5.4 power switch header pi ns 6 and 8 can be connected to a front panel momentary-contact power switch. the switch must pull the sw_on# pin to ground for at least 50 ms to signal the power supply to switch on or off. (the time requ irement is due to inte rnal debounce circuitry on the board.) at least two seconds must pass before the power supply will recognize another on/off signal. intel desktop board DX58SO technical product specification 52 2.2.2.6 front panel usb headers figure 13 is a connection diagram for the front panel usb headers. # integrator?s notes ? the +5 v dc power on the usb headers is fused. ? use only a front panel usb connector that conforms to the usb 2.0 specification for high-speed usb devices. figure 13. connection diagram for front panel usb headers 2.2.2.7 front panel ieee 1394a header figure 14 is a connection diagram for the ieee 1394a header. # integrator?s notes ? the +12 v dc power on the ieee 1394a header is fused. ? the ieee 1394a header provides one ieee 1394a port. figure 14. connection diagram for ieee 1394a header technical reference 53 2.3 jumper block caution do not move the jumper with the power on. always turn off the power and unplug the power cord from the computer before chan ging a jumper setting. otherwise, the board could be damaged. figure 15 shows the location of the jumper block. the 3- pin jumper block determines the bios setup program?s mode. table 23 describes the jumper settings for the three modes: normal , configure, and recovery. when the jumper is set to configure mode and the computer is powered-up, the bios compares the processor version and the microcode version in the bios and reports if the two match. figure 15. location of the jumper block intel desktop board DX58SO technical product specification 54 table 23. bios setup configuration jumper settings function/mode jumper setting configuration normal 1-2 321 the bios uses current configuration information and passwords for booting. configure 2-3 321 after the post runs, setup runs automatically. the maintenance menu is displayed. note that this configure mode is the only way to clear the bios/cmos settings. press f9 (restore defaults) while in configure mode to restore the bios/cmos settings to their default values. recovery none 321 the bios attempts to recover the bios configuration. a recovery cd or flash drive is required. technical reference 55 2.4 mechanical considerations 2.4.1 form factor the board is designed to fit into an atx-form-factor chassis. figure 16 illustrates the mech anical form factor for the board. dimensions are given in inches [millimeters]. the outer dimensions are 12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters]. location of the i/ o connectors and mounting holes are in compliance with the atx specification. figure 16. board dimensions intel desktop board DX58SO technical product specification 56 2.5 electrical considerations 2.5.1 power supply considerations caution the +5 v standby line from the power supply must be capable of providing adequate +5 v standby current. failure to do so can damage the power supply. the total amount of standby current required depe nds on the wake devices supported and manufacturing options. additional power required will depend on configurations chosen by the integrator. the power supply must comply with the indi cated parameters of the atx form factor specification. ? the potential relation between 3.3 vdc and +5 vdc power rails ? the current capability of the +5 vsb line ? all timing parameters ? all voltage tolerances for example, for a system consisting of a supported 130 w processor (see section 1.4 on page 14 for a list of supported processors), 1 gb ddr3 ram, one high end video card, one hard disk drive, one optical driv e, and all board peripherals enabled, the minimum recommended power supply is 460 w. table 24 lists the recommended power supply current values. table 24. recommended power supply current values output voltage 3.3 v 5 v 12 v1 12 v2 -12 v 5 vsb current 22 a 20 a 16 a 16 a 0.3 a 1.5 a for information about refer to selecting an approp riate power supply http://support.intel.com/support/motherboards/desktop/sb /cs-026472.htm technical reference 57 2.5.2 fan header current capability caution the processor fan must be connected to the processor fan header, not to a chassis fan header. connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation. table 25 lists the current capability of the fan headers. table 25. fan header current capability fan header maximum available current processor fan 2.0 a front chassis fan 1.5 a ioh fan 3.5 a (direct connect 12 v rail) rear chassis fan 1.5 a auxiliary rear chassis fan 2.0 a 2.5.3 add-in board considerations the board is designed to provide 2 a (avera ge) of current for each add-in board from the +5 v rail. the total +5 v current draw for add-in boards for a fully loaded board (all six expansion slots filled) must not exceed the system?s power supply +5 v maximum current or 14 a in total. 2.6 thermal considerations caution a chassis with a maximum intern al ambient temperature of 38 o c at the processor fan inlet is a requirement. use a processor he at sink that provides omni-directional airflow to maintain required airflow ac ross the processor voltage regulator area. caution failure to ensure appropriate airflow may re sult in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. for a list of chassis that have been tested with intel desktop boards please refer to the following website: http://developer.intel.com/design/motherbd/cooling.htm all responsibility for determining the adeq uacy of any thermal or system design remains solely with the reader. intel ma kes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance. intel desktop board DX58SO technical product specification 58 caution ensure that the ambient temperature does not exceed the board?s maximum operating temperature. failure to do so could cause components to exceed their maximum case temperature and malfunction. for info rmation about the maximum operating temperature, see the environmental specifications in section 2.8. caution ensure that proper airflow is maintained in the processor voltage regulator circuit. failure to do so may result in damage to the voltage regu lator circuit. the processor voltage regulator area (shown in figure 17) can reach a temperature of up to 85 o c in an open chassis. figure 17 shows the locations of the localized high temperature zones. item description a processor voltage regulator area b processor c intel 82x58 ioh d intel 82801ijr ich10r figure 17. localized high temperature zones technical reference 59 table 26 provides maximum case temperatures for the components that are sensitive to thermal changes. the operating temperat ure, current load, or operating frequency could affect case temperat ures. maximum case temperatures are important when considering proper airflow to cool the board. table 26. thermal considerations for components component maximum case temperature processor for processor case temper ature, see processor datasheets and processor specification updates intel 82x58 ioh 105 o c (under bias) intel 82801ijr (ich10r) 105 o c (under bias) for information about refer to processor datasheets and spec ification updates section 1.3, page 14 intel desktop board DX58SO technical product specification 60 2.7 reliability the mean time between failures (mtbf) pred iction is calculated using component and subassembly random failure rates. the calculation is based on the bellcore reliability prediction procedure, tr-nwt-000332, issue 4, september 1991. the mtbf prediction is used to estimate repa ir rates and spare parts requirements. the mtbf data is calculated from predicted data at 55 oc. the mtbf for the board is 84,330.82646 hours. 2.8 environmental table 27 lists the environmental specifications for the board. table 27. environmental specifications parameter specification temperature non-operating -40 c to +70 c operating 0 c to +55 c shock unpackaged 50 g trapezoidal waveform velocity change of 170 inches/second2 packaged half sine 2 millisecond product weight (pounds) free fall (inches) velocity change (inches/sec2) <20 36 167 21-40 30 152 41-80 24 136 81-100 18 118 vibration unpackaged 5 hz to 20 hz: 0.01 g2 hz sloping up to 0.02 g2 hz 20 hz to 500 hz: 0.02 g2 hz (flat) packaged 5 hz to 40 hz: 0.015 g2 hz (flat) 40 hz to 500 hz: 0.015 g2 hz sloping down to 0.00015 g2 hz 61 3 overview of bios features 3.1 introduction the board uses an intel bios that is stored in the serial periph eral interface flash memory (spi flash) and can be updated using a disk-based program. the spi flash contains the bios setup program, post, the pci auto-configuration utility, lan eeprom information, and plug and play support. the bios displays a message during post id entifying the type of bios and a revision code. the initial production bioss are identified as sox5810j.86a. when the bios setup configuration jumper is set to configure mode and the computer is powered-up, the bios compares the cpu version and the microcode version in the bios and reports if the two match. the bios setup program can be used to view and change the bios settings for the computer. the bios setup program is acce ssed by pressing the intel desktop board DX58SO technical product specification 62 table 28 lists the bios setup program menu features. table 28. bios setup program menu bar maintenance main advanced perfor mance security power boot exit clears passwords and displays processor information displays processor and memory configuration configures advanced features available through the chipset configures memory, bus and processor overrides sets passwords and security features configures power management features and power supply controls selects boot options saves or discards changes to setup program options table 29 lists the function keys available for menu screens. table 29. bios setup program function keys bios setup program function key description < > or < > selects a different menu screen (mov es the cursor left or right) < > or < > selects an item (moves the cursor up or down) overview of bios features 63 3.4 system management bios (smbios) smbios is a desktop management interfac e (dmi) compliant method for managing computers in a managed network. the main component of smbios is the management information format (mif) database, which contains information about the computing system and its components. using smbios, a system admi nistrator can obtain the system types, capabilities, operational status, and installation dates for system components. the mif database defines the data and provides th e method for accessing this information. the bios enables applications such as third-party management software to use smbios. the bios stores and report s the following smbios information: ? bios data, such as the bios revision level ? fixed-system data, such as peripher als, serial numbers , and asset tags ? resource data, such as memory si ze, cache size, and processor speed ? dynamic data, such as event detection and error logging non-plug and play operating systems require an additional interface for obtaining the smbios information. the bios supports an smbios table interface for such operating systems. using this support, an smbios service-level application running on a non-plug and play operating system can obtain the smbios information. additional board information can be found in the bios under the additional information header under the main bios page. 3.5 legacy usb support legacy usb support enables usb devices to be used even when the operating system?s usb drivers are not yet available. legacy usb support is used to access the bios setup program, and to install an op erating system that supports usb. by default, legacy usb suppo rt is set to enabled. legacy usb support operates as follows: 1. when you apply power to the comput er, legacy support is disabled. 2. post begins. 3. legacy usb support is enabled by the bios allowing you to use a usb keyboard to enter and configure the bios setup program and the maintenance menu. 4. post completes. 5. the operating system loads. while the operating system is loading, usb keyboards and mice are recognized and ma y be used to configure the operating system. (keyboards and mice are not recogn ized during this period if legacy usb support was set to disabled in the bios setup program.) 6. after the operating system loads the usb drivers, all legacy and non-legacy usb devices are recognized by the operating system, and legacy usb support from the bios is no longer used. 7. additional usb legacy feat ure options can be access by using intel integrator toolkit. intel desktop board DX58SO technical product specification 64 to install an operating system that supports usb, verify that legacy usb support in the bios setup program is set to enabled and follow the operating system?s installation instructions. 3.6 bios updates the bios can be updated using either of the following utilities, which are available on the intel world wide web site: ? intel ? express bios update utility, which enables automated updating while in the windows environment. using this utility, the bios can be updated from a file on a hard disk, a usb drive (a flash drive or a usb hard drive), or a cd-rom, or from the file location on the web. ? intel ? flash memory update utility, which requires booting from dos. using this utility, the bios can be updated from a file on a hard disk, a usb drive (a flash drive or a usb hard drive), or a cd-rom. both utilities verify that the updated bios matches the target system to prevent accidentally installing an incompatible bios. note review the instructions distributed with th e upgrade utility before attempting a bios update. for information about refer to bios update utilities http://support.intel.com/support/motherboards/desktop/sb /cs-022312.htm . 3.6.1 language support the bios setup program and help messages ar e supported in us english. additional languages are available in the integrator?s toolkit utility. check the intel website for details. overview of bios features 65 3.6.2 custom splash screen during post, an intel ? splash screen is displayed by de fault. this splash screen can be augmented with a custom splash screen. the intel integrator?s toolkit that is available from intel can be used to create a custom splash screen. note if you add a custom splash screen, it will share space with the intel branded logo. for information about refer to intel ? integrator toolkit http://developer.intel.com/des ign/mo therbd/software/itk/ additional intel ? software tools http://developer.intel.com/products/motherboard/DX58SO/t ools.htm and http://developer.intel.com/d esign/mo therbd/software.htm 3.7 bios recovery it is unlikely that anything will interrupt a bios update; however, if an interruption occurs, the bios could be damaged. table 30 lists the drives and media types that can and cannot be used for bios recovery. the bios recovery media does not need to be made bootable. table 30. acceptable drives/media types for bios recovery media type can be used for bios recovery? cd-rom drive connected to the parallel ata interface yes cd-rom drive connected to the serial ata interface yes usb removable drive (a usb flash drive, for example) yes usb diskette drive (with a 1.44 mb diskette) no usb hard disk drive no legacy diskette drive (with a 1. 44 mb diskette) connected to the legacy diskette drive interface no for information about refer to bios recovery http://www.intel.com/support/m otherboards/desktop/sb/ cs-023360.htm intel desktop board DX58SO technical product specification 66 3.8 boot options in the bios setup program, the user can ch oose to boot from a diskette drive, hard drive, usb drive, usb flash drive, cd-rom, or the network. the default setting is for the diskette drive to be the first boot de vice, the hard drive second, and the atapi cd-rom third. if enabled, the last default boot device is the network. 3.8.1 cd-rom boot booting from cd-rom is supported in compliance to the el torito bootable cd-rom format specification. under the boot me nu in the bios setup program, atapi cd- rom is listed as a boot device. boot devices are defined in pr iority order. accordingly, if there is not a bootable cd in the cd-rom drive, the system will attempt to boot from the next defined drive. 3.8.2 network boot the network can be selected as a boot device. this selection allows booting from the onboard lan or a network add-in card with a remote boot rom installed. pressing the overview of bios features 67 3.9 adjusting boot speed these factors affect system boot speed: ? selecting and configuring peripherals properly ? optimized bios boot parameters 3.9.1 peripheral selection and configuration the following techniques help improve system boot speed: ? choose a hard drive with parameters such as ?power-up to data ready? less than eight seconds, that minimize hard drive startup delays. ? select a cd-rom drive with a fast initialization rate. this rate can influence post execution time. ? eliminate unnecessary add-in adapter features, such as logo displays, screen repaints, or mode changes in post. th ese features may add time to the boot process. ? try different monitors. some monitors initialize and communicate with the bios more quickly, which enables the system to boot more quickly. 3.9.2 bios boot optimizations use of the following bios setup program se ttings reduces the post execution time. ? in the boot menu, set the hard disk drive as the first boot device. as a result, the post does not first seek a diskette driv e, which saves about one second from the post execution time. ? in the peripheral configuration submenu, disable the lan device if it will not be used. this can reduce up to four seconds of option rom boot time. note it is possible to optimize the boot process to the point where the system boots so quickly that the intel logo screen (or a cust om logo splash screen) will not be seen. monitors and hard disk drives with minimum initialization times can also contribute to a boot time that might be so fast that necessary logo screen s and post messages cannot be seen. this boot time may be so fast that some drives might be no t be initialized at all. if this condition should occur, it is possibl e to introduce a programmable delay ranging from zero to 30 seconds by 5 second incr ements (using the hard disk pre-delay feature of the advanced menu in the drive configuration submenu of the bios setup program). intel desktop board DX58SO technical product specification 68 3.10 bios security features the bios includes security features that restrict access to the bios setup program and who can boot the computer. a superv isor password and a user password can be set for the bios setup program and for booting the computer, with the following restrictions: ? the supervisor password gives unrestricte d access to view and change all the setup options in the bios setup program. this is the supervisor mode. ? the user password gives restri cted access to view and ch ange setup options in the bios setup program. this is the user mode. ? if only the supervisor password is set, pressing the overview of bios features 69 3.11 bios performance features the bios includes the following options to provide custom performance enhancements when using intel core i7 processors. ? processor frequency adjustment ? processor voltage adjustment ? memory clock adjustments ? memory voltage adjustments ? qpi bus voltage adjustment ? vtt voltage adjustment intel desktop board DX58SO technical product specification 70 71 4 error messages and beep codes 4.1 speaker the board-mounted speaker provides audi ble error code (beep code) information during post. for information about refer to the location of the onboard speaker figure 1, page 11 4.2 bios beep codes whenever a recoverable error occurs duri ng post, the bios displays an error message describing the problem (see table 33). table 33. beep codes type pattern frequency memory error three long beeps 1280 hz thermal warning four alternating beeps: high tone, low tone, high tone, low tone high tone: 2000 hz low tone: 1600 hz 4.3 bios error messages table 34 lists the error messages and pr ovides a brief description of each. table 34. bios error messages error message explanation cmos battery low the battery may be losing power. replace the battery soon. cmos checksum bad the cmos checksum is incorrect. cmos memory may have been corrupted. run setup to reset values. memory size decreased memory size has decr eased since the last boot. if no memory was removed, then memory may be bad. no boot device available system did not find a device to boot. intel desktop board DX58SO technical product specification 72 4.4 port 80h post codes during the post, the bios generates diagno stic progress codes (post codes) to i/o port 80h. if the post fails, execution stops and the last post code generated is left at port 80h. this code is useful for de termining the point wher e an error occurred. displaying the post codes requires a pci bu s add-in card, often called a post card. the post card can decode the port and disp lay the contents on a medium such as a seven-segment display. note the post card must be installed in pci bus connector 1. the following tables provide information about the post codes generated by the bios: ? table 35 lists the port 80h post code ranges ? table 36 lists the port 80h post codes themselves ? table 37 lists the port 80h post sequence note in the tables listed above, all post codes and range values are listed in hexadecimal. table 35. port 80h post code ranges range category/subsystem 00 ? 0f debug codes: can be used by any peim/driver for debug. 10 ? 1f host processors: 1f is an unrecoverable cpu error. 20 ? 2f memory/chipset: 2f is no memory detected or no useful memory detected. 30 ? 3f recovery: 3f indicated recovery failure. 40 ? 4f reserved for future use. 50 ? 5f i/o busses: pci, usb, ata, etc. 5f is an unrecoverable error. start with pci. 60 ? 6f reserved for future use (for new busses). 70 ? 7f output devices: all output co nsoles. 7f is an unrecoverable error. 80 ? 8f reserved for future us e (new output console codes). 90 ? 9f input devices: keyboard/mouse . 9f is an unrecoverable error. a0 ? af reserved for future use (new input console codes). b0 ? bf boot devices: includes fixed media and removable media. bf is an unrecoverable error. c0 ? cf reserved for future use. d0 ? df boot device selection. e0 ? ff e0 ? ee: miscellaneous codes. see table 36. ef : boot/s3 resume failure. f0 ? ff: ff processor exception. error messages and beep codes 73 table 36. port 80h post codes post code description of post operation host processor 10 power-on initialization of the host processor (boot strap processor) 11 host processor cache initialization (including aps) 12 starting application processor initialization 13 smm initialization chipset 21 initializing a chipset component memory 22 reading spd from memory dimms 23 detecting presence of memory dimms 24 programming timing parameters in the memory controller and the dimms 25 configuring memory 26 optimizing memory settings 27 initializing memory, such as ecc init 29 memory testing completed pci bus 50 enumerating pci busses 51 allocating resources to pci bus 52 hot plug pci controller initialization 53 ? 57 reserved for pci bus usb 58 resetting usb bus 59 reserved for usb ata/atapi/sata 5a resetting pata/sata bus and all devices 5b reserved for ata smbus 5c resetting smbus 5d reserved for smbus local console 70 resetting the vga controller 71 disabling the vga controller 72 enabling the vga controller remote console 78 resetting the console controller 79 disabling the console controller 7a enabling the console controller continued intel desktop board DX58SO technical product specification 74 table 36. port 80h post codes (continued) post code description of post operation keyboard (usb) 90 resetting keyboard 91 disabling keyboard 92 detecting presence of keyboard 93 enabling the keyboard 94 clearing keyboard input buffer 95 instructing keyboard controller to run self test (ps/2 only) mouse (usb) 98 resetting mouse 99 disabling mouse 9a detecting presence of mouse 9b enabling mouse fixed media b0 resetting fixed media b1 disabling fixed media b2 detecting presence of a fixed me dia (ide hard drive detection etc.) b3 enabling/configuring a fixed media removable media b8 resetting removable media b9 disabling removable media ba detecting presence of a removable media (ide, cd-rom detection, etc.) bc enabling/configuring a removable media bds d y trying boot selection y (y=0 to 15) pei core e0 started dispatching peims (emitted on first report of efi_sw_pc_init_begin efi_sw_pei_pc_handoff_to_next) e2 permanent memory found e1, e3 reserved for pei/peims dxe core e4 entered dxe phase e5 started dispatching drivers e6 started connecting drivers continued error messages and beep codes 75 table 36. port 80h post codes (continued) post code description of post operation dxe drivers e7 waiting for user input e8 checking password e9 entering bios setup eb calling legacy option roms runtime phase/efi os boot f4 entering sleep state f5 exiting sleep state f8 efi boot service exitbootservices ( ) has been called f9 efi runtime service setvirtual addressmap ( ) has been called fa efi runtime service resetsystem ( ) has been called peims/recovery 30 crisis recovery has initiated per user request 31 crisis recovery has initiated by software (corrupt flash) 34 loading recovery capsule 35 handing off control to the recovery capsule 3f unable to recover intel desktop board DX58SO technical product specification 76 table 37. typical port 80h post sequence post code description 21 initializing a chipset component 22 reading spd from memory dimms 23 detecting presence of memory dimms 25 configuring memory 28 testing memory 34 loading recovery capsule e4 entered dxe phase 12 starting application processor initialization 13 smm initialization 50 enumerating pci busses 51 allocating resourced to pci bus 92 detecting the presence of the keyboard 90 resetting keyboard 94 clearing keyboard input buffer 95 keyboard self test eb calling video bios 58 resetting usb bus 5a resetting pata/sata bus and all devices 92 detecting the presence of the keyboard 90 resetting keyboard 94 clearing keyboard input buffer 5a resetting pata/sata bus and all devices 28 testing memory 90 resetting keyboard 94 clearing keyboard input buffer e7 waiting for user input 01 int 19 00 ready to boot 77 5 regulatory compliance and battery disposal information 5.1 regulatory compliance this section contains the following regulatory compliance information for intel desktop board DX58SO: ? safety standards ? european union declaration of conformity statement ? product ecology statements ? electromagnetic compatibility (emc) standards ? product certification markings 5.1.1 safety standards intel desktop board DX58SO complies with the safety standards stated in table 38 w hen correctly installed in a compatible host system. table 38. safety standards standard title csa/ul 60950-1, first edition information technology equipment ? safety - part 1: general requirements (usa and canada) en 60950-1:2006, second edition information technology equipmen t ? safety - part 1: general requirements (european union) iec 60950-1:2005, second edition information technology equipmen t ? safety - part 1: general requirements (international) intel desktop board DX58SO technical product specification 78 5.1.2 european union declaration of conformity statement we, intel corporation, declare under our sole responsibility that the product intel ? desktop board DX58SO is in co nformity with all applicab le essential requirements necessary for ce marking, following the provisions of the european council directive 2004/108/ec (emc directive) and 2006/ 95/ec (low voltage directive). the product is properly ce marked demo nstrating this conformity and is for distribution within all member states of the eu with no restrictions. this product follows the provisions of the european directives 2004/108/ec and 2006/95/ec. ? e?tina tento vyrobek odpovd po?adavk ? m evropskych sm rnic 2004/108/ec a 2006/95/ec. dansk dette produkt er i overensstemmels e med det europ?iske direktiv 2004/108/ec & 2006/95/ec. dutch dit product is in navolging van de bepalingen van europees directief 2004/108/ec & 2006/95/ec. eesti antud toode vastab euroopa direktiivides 2004/108/ec ja 2006/95/ec kehtestatud n?uetele. suomi t?m? tuote noudattaa eu-direktiivin 2004/108/ec & 2006/95/ec m??r?yksi?. fran?ais ce produit est conforme aux exigen ces de la directive europenne 2004/108/ec & 2006/95/ec. deutsch dieses produkt entspricht den bestimm ungen der europ?ischen richtlinie 2004/108/ec & 2006/95/ec. ??????? ? ? ??? ??????? ?? ????? ?? ?????? ????? 2004/108/ec ? 2006/95/ec. magyar e termk megfelel a 2004/108/ec s 2006/95/ec eurpai irnyelv el ? rsainak. icelandic tessi vara stenst reglugere evrps ka efnahags bandalagsins nmer 2004/108/ec & 2006/95/ec. italiano questo prodotto conforme a lla direttiva europea 2004/108/ec & 2006/95/ec. latvie?u ?is produkts atbilst eiropas direkt vu 2004/108/ec un 2006/95/ec noteikumiem. lietuvi? ?is produktas atitinka europos direktyv ? 2004/108/ec ir 2006/95/ec nuostatas. malti dan il-prodott hu konformi mal-pr ovvedimenti tad-direttivi ewropej 2004/108/ec u 2006/95/ec. norsk dette produktet er i henhold til bestemmelsene i det europeiske direktivet 2004/108/ec & 2006/95/ec. polski niniejszy produkt jest zgodny z postan owieniami dyrektyw unii europejskiej 2004/108/ec i 73/23/ewg. portuguese este produto cumpre com as norm as da diretiva europia 2004/108/ec & 2006/95/ec. regulatory compliance and battery disposal information 79 espa?ol este producto cumple con las norm as del directivo europeo 2004/108/ec & 2006/95/ec. slovensky tento produkt je v slade s us tanoveniami eurpskych direktv 2004/108/ec a 2006/95/ec. sloven? ? ina izdelek je skladen z dolo ?bami evropskih direktiv 2004/108/ec in 2006/95/ec. svenska denna produkt har tillverkats i enlighet med eg-direktiv 2004/108/ec & 2006/95/ec. trk?e bu rn, avrupa birli ?i?nin 2004/108/ec ve 2006/95/ec y?nergelerine uyar. 5.1.3 product ecology statements the following information is provided to address worldwide product ecology concerns and regulations. 5.1.3.1 disposal considerations this product contains the following material s that may be regulated upon disposal: lead solder on the printed wiring board assembly. 5.1.3.2 recycling considerations as part of its commitment to environmental responsibility, intel has implemented the intel product recycling program to allow retail consumers of intel?s branded products to return used products to selected locations for proper recycling. please consult the http://www.intel.com/intel/other/ehs/product_ecology for the details of this program, including the scope of covered products, available locations, shipping instructions, terms and conditions, etc. ?????????? intel product recycling program ????????????????? ????? http://www.intel.com/intel/other/ehs/product_ecology ????p??????? deutsch als teil von intels engagement fr den um weltschutz hat das unternehmen das intel produkt-recyclingprogramm implementiert, das einzelhandelskunden von intel markenprodukten erm?glicht, gebrauchte produkte an ausgew ?hlte standorte fr ordnungsgem??es recycling zurckzugeben. details zu diesem programm, einschlie? lich der darin eingeschlossenen produkte, verfgbaren standorte, versandanweisungen , bedingungen usw., finden sie auf der http://www.intel.com/intel/other/ehs/product_ecology intel desktop board DX58SO technical product specification 80 espa?ol como parte de su compromiso de responsabilidad medioambiental, intel ha implantado el programa de reciclaje de productos intel, que permite que los consumidores al detalle de los productos intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado. consulte la http://www.intel.com/intel/other/ehs/product_ecology para ver los detalles del programa, que incluye los productos que abarca, los lugares disponibles, instrucciones de envo, trm inos y condiciones, etc. fran?ais dans le cadre de son engagement pour la protection de l'environnement, intel a mis en ?uvre le programme intel product recy cling program (programme de recyclage des produits intel) pour pe rmettre aux consommateurs de produits intel de recycler les produits uss en les retour nant des adresses spcifies. visitez la page web http://www.intel.com/intel/other/ehs/product_ecology pour en savoir plus sur ce programme, savoir les produits concerns, les adresses disponibles, les instructions d'expdition, les cond itions gnrales, etc. ?Z ???ho??h???K? ?u???????m??u?? ??k?? u????s????? http://www.intel.com/in tel/other/ehs/product_ecology ?ZE malay sebagai sebahagian daripada komitmennya terhadap ta nggungjawab persekitaran, intel telah melaksanakan program kita r semula produk untuk membenarkan pengguna-pengguna runcit produk jenama intel memulangkan produk terguna ke lokasi-lokasi terpilih untuk dikitarkan semula dengan betul. sila rujuk http://www.intel.com/intel/other/ehs/product_ecology untuk mendapatkan butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi tersedia, arahan penghantaran, terma & syarat, dsb. portuguese como parte deste compromisso com o respei to ao ambiente, a intel implementou o programa de reciclagem de produtos para que os consumidores finais possam enviar produtos intel usados para locais selecionad os, onde esses produtos s?o reciclados de maneira adequada. consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em ingls) para obter os detalhes sobre este programa , inclusive o escopo dos produtos cobertos, os locais disponveis, as instru??es de envio, os termos e condi??es, etc. regulatory compliance and battery disposal information 81 russian ???? ? ?? ????? ???? ?? , intel ???? ???? ?????? ??? intel (product recycling program) ?? ???????? ???? ?????? ?? ??? intel ????? ???? ????? ??? ??????????? ?? ?? ???? ??????. ???? , ???? ? ?? - ?? http://www.intel.com/intel/other/ehs/product_ecology ? ?????? ???? , ??????? ??? , ??? ???, ???? ??? , ????? ??? . . trk?e intel, ?evre sorumlulu?una ba ? ml l ? n n bir par?as olarak, perakend e tketicilerin intel markal kullan lm ? rnlerini belirlenmi ? merkezlere iade edip uygun ?ekilde geri d?n ? trmesini ama?layan intel rnleri geri d?n ?m program ?n uygulamaya koymu ?tur. bu program n rn kapsam , rn iade merkezleri, nakliye talimatlar , kay tlar ve ?artlar v.s dahil btn ayr nt lar n ?grenmek i?in ltfen http://www.intel.com/intel/other/ehs/product_ecology web sayfas na gidin. 5.1.3.3 lead free desktop board this intel desktop board is a european union restriction of hazardous substances (eu rohs directive 2002/95/ec) compliant product. eu rohs restricts the use of six materials. one of the six re stricted materials is lead. this intel desktop board is lead free althou gh certain discrete components used on the board contain a small amount of lead whic h is necessary for component performance and/or reliability. this intel desktop board is referred to as ?lead-free second level interconnect.? the board substrate and the solder connections from the board to the components (second-level connections) are all lead free. china bans the same substances and has the same limits as eu rohs; however it requires different product marking and contro lled substance information. the required mark shows the environmental friendly usage period (efup). the efup is defined as the number of years for which controlled listed substances will not leak or chemically deteriorate while in the product. table 39 shows the various forms of the ?lead-free 2 nd level interconnect? mark as it appears on the board and accompanying collateral. intel desktop board DX58SO technical product specification 82 table 39. lead-free board markings description mark lead-free 2 nd level interconnect: this symbol is used to identify electrical and electronic assemblies and components in which the lead (pb) concentration level in the desktop board substrate and the solder connections from the board to the components (second-level interconnect) is not greater than 0.1% by weight (1000 ppm). or or regulatory compliance and battery disposal information 83 5.1.4 emc regulations intel desktop board DX58SO complies wi th the emc regulations stated in table 40 w hen correctly installed in a compatible host system. table 40. emc regulations regulation title fcc 47 cfr part 15, subpart b title 47 of the code of federal regu lations, part15, subpart b, radio frequency devices. (usa) ices-003 issue 4 (class b) interference-causing equipment standard, digital apparatus. (canada) en55022:2006 (class b) limits and methods of measurement of radio interference characteristics of information technology equi pment. (european union) en55024:1998 (class b) information technology equipment ? i mmunity characteristics limits and methods of measurement. (european union) en55022:2006 (class b) australian communications authority, standard for electromagnetic compatibility. (australia and new zealand) cispr 22:2005 +a1:2005 +a2:2006 (class b) limits and methods of measurement of radio disturbance characteristics of information technology equi pment. (international) cispr 24:1997 +a1:2001 +a2:2002 (class b) information technology equipment ? i mmunity characteristics ? limits and methods of measurement. (international) vcci v-3/2007.04, v-4/2007.04, class b voluntary control for interference by information technology equipment. (japan) japanese kanji statement translation: this is a class b product based on the standard of the voluntary control council for inte rference from information technology equipment (vcci). if this is used near a radio or television receiver in a domestic environment, it may cause radio interf erence. install and use the equipment according to the instruction manual. intel desktop board DX58SO technical product specification 84 korean class b statement translation: this is household equipment that is certified to comply with emc requirements. you may use this equipment in residential environments and other non-residential environments. 5.1.5 product certification markings (board level) intel desktop board DX58SO has the prod uct certification markings shown in table 41: table 41. product certification markings description mark ul joint us/canada recognized component mark. includes adjacent ul file number for intel desktop boards: e210882. fcc declaration of conformi ty logo mark for class b equipment. includes intel name and DX58SO model designation. ce mark. declaring compliance to european union (eu) emc directive and low voltage directive. australian communications authority (a ca) and new zealand radio spectrum management (nz rsm) c-tick mark. includes adjacent intel supplier code number, n-232. japan vcci (voluntary control council for interference) mark. s. korea mic (ministry of information and communication) mark. includes adjacent mic certification number: cpu-DX58SO (b) taiwan bsmi (bureau of standards, metrology and inspections) mark. includes adjacent intel company number, d33025. printed wiring board manufacturer?s reco gnition mark. consists of a unique ul recognized manufacturer?s logo, along with a flammability rating (solder side). v-0 china rohs/environmentally friendly use period logo: this is an example of the symbol used on intel desktop boards and associated collateral. the color of the mark may vary depending upon the application. the environmental friendly usage period (efup) for intel desktop boards has been determined to be 10 years. regulatory compliance and battery disposal information 85 5.2 battery disposal information caution risk of explosion if the battery is replaced with an incorrect type. batteries should be recycled where possible. disposal of used batteries must be in accordance with local environmental regulations. precaution risque d'explosion si la pile usage est remp lace par une pile de type incorrect. les piles usages doivent tre recycles dans la mesure du possible. la mise au rebut des piles usages doit respecter les rglementa tions locales en vigueur en matire de protection de l'environnement. forholdsregel eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. batterier b?r om muligt genbruges. bortskaffels e af brugte batterier b?r foreg? i overensstemmelse med g?ldende milj?lovgivning. obs! det kan oppst? eksplosjonsfare hvis batteriet skiftes ut med feil type . brukte batterier b?r kastes i henhold til gjeldende milj?lovgivning. viktigt! risk f?r explosion om batteriet ers?tts med felaktig batterityp. batterier ska kasseras enligt de lokala milj ?v?rdsbest?mmelserna. varo r?j?hdysvaara, jos pariston tyyppi on v??r?. paristot on kierr?tett?v?, jos se on mahdollista. k?ytetyt paristot on h?vi tett?v? paikallisten ymp?rist?m??r?ysten mukaisesti. vorsicht bei falschem einsetzen einer neuen batteri e besteht explosionsgefahr. die batterie darf nur durch denselben oder einen en tsprechenden, vom hersteller empfohlenen batterietyp ersetzt werden. entsorgen si e verbrauchte batterien den anweisungen des herstellers entsprechend. avvertimento esiste il pericolo di un esplos ione se la pila non viene so stituita in modo corretto. utilizzare solo pile uguali o di tipo equivalente a quelle co nsigliate dal produttore. per disfarsi delle pile usate, seguir e le istruzioni del produttore. intel desktop board DX58SO technical product specification 86 precaucin existe peligro de explosin si la pila no se cambia de forma adecuada. utilice solamente pilas iguales o del mismo tipo qu e las recomendadas por el fabricante del equipo. para deshacerse de las pilas usad as, siga igualmente las instrucciones del fabricante. waarschuwing er bestaat ontploffingsgevaar als de batteri j wordt vervangen door een onjuist type batterij. batterijen moeten zoveel moge lijk worden gerecycled. houd u bij het weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving. aten??o haver risco de explos?o se a bateria for su bstituda por um tipo de bateria incorreto. as baterias devem ser recicladas nos locais apropriados. a elimina??o de baterias usadas deve ser feita de acordo com as regulamenta??es ambientais da regi?o. a ? ciaro?zna ?? ?? ?? ?? , ??? ??????? ????? ???????? . ????? ???? , ?????? , ?????? . ????? ? ? ?????? ??? ???? ?? ?????????? ????? . upozornn v p ? pad vym ny baterie za nesprvny druh m ? ?e dojt k vybuchu. je-li to mo?n, baterie by m ly byt recyklovny. baterie je t ? eba zlikvidovat v souladu s mstnmi p? edpisy o ?ivotnm prost ? ed. ????? ????? ?????? ?? ???? ? ????? ? ??? ????????? ? ? ??????? ??. ? ???? ? ?? ? ????????? ?? ?? ???? ?? ???? . ????? ?? ????????????? ???? ?? ? ???? ????? ? ??? ?? ? ???|????????? ????????? . vigyazat ha a telepet nem a megfelel ? tpus telepre cserli, az felrobbanhat. a telepeket lehet ? sg szerint jra kell hasznostani. a hasznlt telepeke t a helyi k?rnyezetvdelmi el ? rsoknak megfelel ? en kell kiselejtezni. regulatory compliance and battery disposal information 87 awas risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. bateri sepatutnya dikitar semula jika boleh. pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. ostrze ? enie istnieje niebezpiecze stwo wybuchu w przypadku zastosowania niew ? a ?ciwego typu baterii. zu ? yte baterie nale ? y w miar ? mo ? liwo ?ci utylizowa ? zgodnie z odpowiednimi przepisami ochrony ?rodowiska. precau ? ie risc de explozie, dac ? bateria este ?nlocuit ? cu un tip de baterie necorespunz ? tor. bateriile trebuie reciclate, dac ? este posibil. depozitarea bateriilor uzate trebuie s ? respecte reglement ? rile locale privind protec ? ia mediului. ??????? ??????? ???? ??????? ? ??? ? ? ???. ???? ???? ? ???????? ????? . ?????? ???? ???? ??? ????? , ???? ??? ?????? . upozornenie ak batriu vymente za nesp rvny typ, hroz nebezpe ?enstvo jej vybuchu. batrie by sa mali pod ? a mo?nosti v?dy recyklova ? . likvidcia pou?itych batri sa mus vykonva ? v slade s miestnymi predpismi na ochranu ?ivotnho prostredia. pozor zamenjava baterije z baterijo druga ?nega tipa lahko povzro ?i eksplozijo. ? e je mogo ?e, baterije reciklirajte. rabljene bate rije zavrzite v skladu z lokalnimi okoljevarstvenimi predpisi. . uyari yanl ? trde pil tak ld ? nda patlama riski vard r. piller mmkn oldu? unda geri d?n ?trlmelidir. kullan lm ? piller, yerel ?evre yasalar na uygun olarak at lmal d r. o ? ?????? ???? ?????? ? , ???? ?????? ??? ???. ? ????? , ?????? ???? ? ?????. ????? ??????? ???? ?? ? ?????? ???? ???? ? , ??? ? ????? . intel desktop board DX58SO technical product specification 88 |
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